Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl−) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40–70 nm) is significantly influenced by the action of the additives. In the presence of either Cl− or SPS solid wire growth is observed, however, when PEG is added with Cl− the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl− and PEG restores the growth of wires.