On the use of OSL of chip card modules with molding for retrospective and accident dosimetry

The potential of optically stimulated luminescence of wire-bond chip card modules with molded encapsulations for retrospective and accident dosimetry is investigated. Contact-based and contactless modules were studied, the latter finding potential use in electronic documents (e.g. electronic passports, electronic identity cards). Investigations were carried out on intact as well as chemically prepared modules, extracting the filler material. Contact-based modules are characterized according to zero dose signal, correlation between OSL and TL, dose response and long-term signal stability. For prepared modules, the minimum detectable dose immediately after irradiation is 3 mGy and between 20 and 200 mGy for contact-based and contactless modules, respectively. Dose recovery tests on contact-based modules indicate that the developed methodology yields results with sufficient accuracy for measurements promptly after irradiation, whereas a systematic underestimation is observed for longer delay times. The reasons for this behaviour are as yet not fully understood.

► Chip cards with molded encapsulations have potential for retrospective dosimetry.
► Extraction of filler material strongly increases sensitivity.
►  Correction for signal fading has so far not been successful.