کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4564069 1330922 2011 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Compositional and varietal influence of finger millet flour on rheological properties of dough and quality of biscuit
موضوعات مرتبط
علوم زیستی و بیوفناوری علوم کشاورزی و بیولوژیک دانش تغذیه
پیش نمایش صفحه اول مقاله
Compositional and varietal influence of finger millet flour on rheological properties of dough and quality of biscuit
چکیده انگلیسی

Biscuits prepared from flour composites containing 60:40 and 70:30 (w/w) finger millet:wheat flour were evaluated for its dough characteristics and biscuit quality. Hardness of biscuit dough measured by textural profile analysis was more in 60:40 combination than in 70:30 level. The dough became more adhesive with higher level of wheat flour and it varied across varieties. Extensograph data also showed that resistance of biscuit dough increased with the increasing levels of wheat flour. However, very little difference was observed between addition of 30 and 40 g/100 g wheat flour in terms of resistance to extension. Wheat composite flour (40 g/100 g) had higher water absorption capacity than in 30 g/100 g composite flour. Bandwidth of composite flour was narrower in 40 g/100 g wheat flour composite. Expansion of biscuit and breaking strength after baking was more in 70:30 composite than in 60:40. Among the varieties used, VL-324 brought about the positive changes of composite flour in rheological characteristics in terms of adhesiveness, extensibility and resistance to extension, which in turn improves biscuit quality. It provided better physical quality biscuit dough and biscuit in terms of its spread ratio, density and breaking strength. Studies indicated that composite of finger millet and wheat flour (60:40) was found better, particularly in case of biscuit quality. Out of six varieties, VL-324 was found best in terms of biscuit quality as well as acceptability.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: LWT - Food Science and Technology - Volume 44, Issue 3, April 2011, Pages 616–621
نویسندگان
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