کد مقاله کد نشریه سال انتشار مقاله انگلیسی ترجمه فارسی نسخه تمام متن
4921255 1362945 2017 4 صفحه PDF سفارش دهید دانلود کنید
عنوان انگلیسی مقاله
Cohesion strength and atomic structure of W-Cu graded interfaces
موضوعات مرتبط
مهندسی و علوم پایه مهندسی انرژی مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
Cohesion strength and atomic structure of W-Cu graded interfaces
چکیده انگلیسی
W-Cu graded interface is a solution to big differences of properties between W and Cu, while the number and composition of graded layers in the literature are quite different. The present first principles calculation reveals that W-rich graded interfaces possess higher strength and lower interface energy than Cu-rich counterparts. It shows that the differences of thermal expansion and Young's modulus between overlayer and substrate are decisive factors in the design of Cu-rich and W-rich graded interfaces, respectively. A graded structure of W8Cu1/W7Cu2/W6Cu3/Cu6W3/Cu8W1 is therefore suggested theoretically.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volume 117, April 2017, Pages 20-23
نویسندگان
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