The temperature dependence of resistivity and solidifying process of Al63Cu27Sn10 alloy

In the heating and cooling process, there is good superposition and consistency of the ρ-T curves and DSC curves, which verifies the accuracy of resistivity method. The results show that monotectic reaction occurs at 575 °C, and the range of the immiscible area is from 530 °C to 635 °C for Al63Cu27Sn10 alloy. Under conventional casting condition, the microstructure of Al63Cu27Sn10 immiscible alloy melt and the solidifying process were discussed by differential scanning calorimetry (DSC), thermal analysis method (TAM), X-ray diffraction (XRD), scanning electron microscopy (SEM). The results show that: Al63Cu27Sn10 alloy dose occur liquid phase separation at the range from 530 °C to 635 °C, and the small volume phase rich Sn droplets tends to gather to the middle to form the core-shell structure.