کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
545083 | 871806 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this paper, the effect of trace addition of Cr on the mechanical properties and reliability on Sn–8Zn–3Bi solder alloys was investigated. It has been demonstrated that the microstructure of solder alloys was refined after doping traces of Cr. The elongation reaches up to 40.63% after doping 0.1% Cr; and the fracture mechanism converts from quasi-cleavage fracture into ductile fracture. With aging time of 0, 4, 9 and 16 days, mechanical property of Sn–8Zn–3Bi–0.3Cr alloy was improved slightly. It was found that the Sn–Zn–Cr phase was increased and Zn in alloy was consumed after aging, so that the amount of primary Zn phase was reduced and microstructure was improved.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 52, Issue 3, March 2012, Pages 585–588
Journal: Microelectronics Reliability - Volume 52, Issue 3, March 2012, Pages 585–588
نویسندگان
Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao,