Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

An alternative method for exposing IC structures in stacked die packages is described in this paper. Conventional preparation of stacked die packages is complex and time-consuming, requiring costly equipment and experienced operators. This paper presents a method that uses the brittleness of silicon for controlled removal of silicon dies by micro-abrasive blasting. Micro-abrasive blasting affects only the top silicon die; lower dies are protected by the elastic adhesive or the die-attach tape. Dissolving the adhesive layers by chemical wet etching allows step-by-step removal of the stacked die layers. This method is fast and does not require expensive equipment.