کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
611185 | 880668 | 2009 | 4 صفحه PDF | دانلود رایگان |
Using an electroless replacement deposition method, large-area superhydrophobic metal substrate could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper substrate and HAuCl4 solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu2O formed on the surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules.
Large-area superhydrophobic metal substrate with a contact angle higher than 150 degrees without any modification with long chain thiol or perfluoro molecules has been obtained.Figure optionsDownload as PowerPoint slide
Journal: Journal of Colloid and Interface Science - Volume 329, Issue 1, 1 January 2009, Pages 208–211