FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

In this paper, the finite volume method (FVM) based numerical simulation is used for the flow visualization of capillary driven underfill process for different solder bump arrangements of flip chip packages is presented. Three different 3D flip chip package models are developed and simulated using computational fluid dynamic (CFD) code, FLUENT 6.3. Capillary action and cross viscosity model are taken into account in the simulation. One-line dispensing method is applied in the analysis and the volume of fluid (VOF) technique is used to track the flow front. The effect of solder balls arrangement on flow behavior and filling time is studied and the solder balls arrangement is found to affect the flow behavior and filling time. The flow patterns of simulation are observed for three flip chip packages and compared. The ability of the proposed model and FLUENT in handling flip chip underfill problems is proved to be excellent.