کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
6601789 1424072 2018 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
3D porous polysiloxane ion-adsorption films for additive fabrication of conductive patterns with high adhesion
ترجمه فارسی عنوان
فیلم های سه بعدی یون پلیسیلوکسان متخلخل برای تولید افزودنی از الگوهای هدایت شده با چسبندگی بالا
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
چکیده انگلیسی
Fabrication of conductive patterns by selective electroless plating is a widely studied process in recent years for its advantages of lower waste, simpler process, less pollution and lower cost compared to the traditional subtractive process. But the poor adhesion of the as-fabricated patterns is the prior problem of this process, which limits the thickness of the conductive patterns in sub micrometer range and thus degrades the electrical properties of the patterns. Many chemical and physical modifications have been used to increase the chemical bonding or physical interaction between substrates and deposited metal, but the effects are limited, especially after thick metal is deposited. However, increasing the interfacial mechanical anchor is an effective alternative to enhance the adhesion but has often been neglected. In our previous work, we have developed a novel patterning-adsorption-plating (PAP) process to additively fabricate copper patterns on flexible polymer substrates. In this paper, polystyrene (PS) microspheres are added into the ion-adsorption ink as templates to fabricate three-dimensional (3D) porous polysiloxane films. Thereafter, the as-fabricated copper patterns show excellent conductivity competitive to that of bulk copper and good adhesion with a distinct increase of mechanical anchor.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 285, 20 September 2018, Pages 111-119
نویسندگان
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