کد مقاله کد نشریه سال انتشار مقاله انگلیسی ترجمه فارسی نسخه تمام متن
6925091 1448677 2018 11 صفحه PDF سفارش دهید دانلود کنید
عنوان انگلیسی مقاله ISI
Modelling transient heat conduction of granular materials by numerical manifold method
ترجمه فارسی عنوان
مدلسازی انتقال گرمای گذرا مواد گرانولی با روش چند منظوره عددی
کلمات کلیدی
روش چند منظوره عددی، هدایت حرارتی گذرا، روش عنصر انعطاف پذیر، مواد گرانول، هدایت گرمادهی موثر،
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر نرم افزارهای علوم کامپیوتر
چکیده انگلیسی
Modelling heat conduction is of significant importance for evaluating temperature effects of granular materials. Since the randomness of the grain structure and the heat resistance characteristics of grain interfaces, to realistically modelling the heat conduction of granular materials, the heat interactive among these random-shaped grains should be correctly reflected. In this study, the numerical manifold method (NMM) is extended to model the transient heat conduction of granular materials. The random-shaped grain structure of granular materials is represented with Voronoi polygons. The heat interactive among grains is realistically simulated by inserting heat conductive cohesive elements between grain boundaries. Besides, an interfacial heat conductivity is defined for the cohesive element to better represent the heat conduct capacity of grain interfaces. As a result, the temperature jumps at grain interfaces are naturally captured due to the dual cover systems of the NMM, while the heat fluxes across the interfaces are assumed to be continuous. To validate the developed numerical method, a benchmark test is carried out. At last, effects of the grain characteristics and interfacial heat resistance on the temperature field as well as the effective heat conductivity (EHC) of a plane consists of granular material are investigated by the developed NMM.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Engineering Analysis with Boundary Elements - Volume 86, January 2018, Pages 45-55
نویسندگان
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