A superior design for high power GaN-based light-emitting diode packages

• The key factor for better performance of a single chip LED package is provided.
• A radiation pattern controlling method of a single chip LED package is developed.
• An integrated LED package is designed with good performance and thermal resistance.

The radiation performance of light-emitting diodes with hemispherical encapsulated lenses at the packaging level is analyzed by a Monte Carlo ray-tracing simulation. Based on optical and thermal considerations, a superior design for integrated LED packages is proposed and consistent trends are obtained in both simulated and experimental results. For integrated LED packages conforming to our design rules, a 7.1% enhancement of light output intensity is demonstrated and a 5.1 °C reduction of junction temperature given a 700 mA injection current is measured. This improvement may be of particular significance for an LED module system with higher power and/or larger arrays.