Oxidation resistant effects of Ag2S in Sn-Ag-Al solder: A mechanism for higher electrical conductivity and less whisker growth

Sn whiskers are spontaneously grown out of the oxide layers and the intermetallic compounds of Sn-based solder alloy, and then the frequent occurrence of Sn whiskers causes a short circuit or trip in the electronic components. With regard to the improvement of the oxidation resistance, Ag2S chalcogenide compounds inhibit the formation of intermetallic compounds and thus interrupt the growth of Sn whiskers at the same time.