کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
814567 906256 2016 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Ti-Nb-Cu Stress Buffer Layer for TiC Cermet/304 Stainless Steel Diffusion Bonding
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مکانیک مواد
پیش نمایش صفحه اول مقاله
Ti-Nb-Cu Stress Buffer Layer for TiC Cermet/304 Stainless Steel Diffusion Bonding
چکیده انگلیسی

Vacuum diffusion bonding of TiC cermet/304 stainless steel (304SS) was conducted and Ti-Nb-Cu multi-interlayer was used to achieve active bonding and residual stress relieving. Detailed microstructure characterization and mechanical property assessment were carried out to evaluate the bonding technology. It is found that an obvious transition zone is formed at the interfaces, and the interfacial products are (Ti, Nb), remnant Nb, remnant Cu and Cu(s.s). The shear strength of TiC/Ti-Nb-Cu/304SS joint can be up to 84.6 MPa when it is bonded at 925 °C for 20 min under a pressure of 8 MPa. Failure occurs in TiC cermet near the interface in a brittle manner. The results indicate that Ti/Nb/Cu interlayer can effectively reduce the harmful effects of intermetallic compounds on the joint performance, and the Nb interlayer plays a major role in the relief of the residual stress.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Rare Metal Materials and Engineering - Volume 45, Issue 3, March 2016, Pages 555–560
نویسندگان
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