Keywords: حرارتی; Thermomigration; Lead-free solder; Under bump metallization; Sn grain orientation; Intermetallic compound
مقالات ISI ترجمه شده حرارتی
مقالات ISI حرارتی (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: حرارتی; Diffusion; Interfaces; Electromigration; Thermomigration; Solder; Intermetallic compound;
Keywords: حرارتی; Phase-field; Electromigration; Grain-boundary migration; Thermomigration; Grand-potential;
Thermomigration kinetics and a novel method to determine the chemical diffusivity of a mixed conductor
Keywords: حرارتی; Thermomigration; Chemical diffusivity; Mixed ionic electronic conductor; BaCo0.70Fe0.22Nb0.08O3 â δ; Thermopower; Heats-of-transport;
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
Keywords: حرارتی; Synchrotron radiation; Thermomigration; Solder interconnect; Cross-interaction; Intermetallic layer;
Thermomigration in SnPb solders: Material model
Keywords: حرارتی; Thermomigration; Soret effect; Dufour effect; NURBS; Sn; Pb; Solder; Alloy;
The critical impact of temperature gradients on Pt filament failure
Keywords: حرارتی; Thermomigration; Electromigration; Breakdown; Pt; Filament; Lifetime;
Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects
Keywords: حرارتی; Thermomigration; Synchrotron radiation; Crystal growth; Precipitation; Intermetallic compound;
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
Keywords: حرارتی; Thermomigration; Metals and alloys; Diffusion; Synchrotron radiation; Finite element method; Intermetallic alloys and compounds
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient
Keywords: حرارتی; Synchrotron radiation; Soldering; Thermomigration; Interfacial reaction; Grain orientation; Intermetallic compound;
Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient
Keywords: حرارتی; Intermetallics; 3D packaging; Synchrotron radiation; Thermomigration; Micro interconnect; Interfacial reaction;
Growth kinetic of Ag3Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient
Keywords: حرارتی; Intermetallic compound; Soldering; Diffusion; Growth kinetics; Thermomigration;
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps
Keywords: حرارتی; Intermetallic compound (IMC) formation; Transient liquid phase soldering (TLPS); Electromigration; Thermomigration; Heat of transport; Effective charge of the moving ion;
Effect of Ni solute on grain boundary diffusivity and structure of βSn
Keywords: حرارتی; Diffusion; Grain boundary diffusion; Beta tin; Molecular dynamics; Electromigration; Thermomigration; Creep;
Electromigration in Sn–Ag solder thin films under high current density
Keywords: حرارتی; Electromigration; Thermomigration; Modeling; Solder material; Thin film
Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
Keywords: حرارتی; Pulsed current electromigration; Thermomigration; SAC solder joint; Duty factor;
Time-dependent changes in morphology and resistance of W/TiN/Ti metal lines upon applying voltage pulses
Keywords: حرارتی; Tungsten; Electromigration; Thermomigration; Joule heating
Thermomigration in solder joints
Keywords: حرارتی; Thermomigration; Solder; Electromigration; Diffusion; Packaging;
Cryogenic etching of n-type silicon with p+ doped walls with the TGZM process through the Al/Si eutectic alloy
Keywords: حرارتی; Silicon; Etching; Cryogenic; Plasma; Thermomigration; Aluminium; Selectivity
Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
Keywords: حرارتی; Electromigration; Thermomigration; Viscoplasticity; Current crowding; Finite element method; Nanoelectronics packaging
Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties
Keywords: حرارتی; Electromigration; Power electronics packaging; Nanoelectronics packaging; Solder joint; Viscoplasticity; Thermomigration;