Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Intermetallics - Volume 79, December 2016, Pages 28-34

N. Zhao, Y. Zhong, M.L. Huang, H.T. Ma, W. Dong,