کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1448485 988675 2009 13 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed
چکیده انگلیسی

Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58 μm s−1), eutectic-like α + β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 57, Issue 1, January 2009, Pages 56–68
نویسندگان
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