TEM and HRTEM study of influence of thermal cycles with stress on dynamic recrystallization in Ti46Al8Nb1B during creep

Short-term tension creep and thermal cycles under compressive stress were performed on Ti46Al8Nb1B in order to explore the dynamic recrystallization (DRX) grains formed during the creep and the impact of thermal cycles under stress to the DRX. After 1600 times' thermal cycles from 300 °C to 800 °C under 300 MPa compressive stress, high density of ledges and thick ledges are found in the interfaces. Two kinds of moiré fringes, instead of 9R structure, can be found in the thick ledges. Ti46Al8Nb1B sample and another sample which was treated by thermal cycles with stress were crept under 300 MPa compressive stress at 800 °C. DRX grains are found in the interfaces in those samples. Those grains, formed at the ledges, have an orientation relationship of [1 0 1]γ//[0 1 1]γR, (1¯1¯1)γ//(1¯11¯)γR with the matrix of γ phases. Thermal cycles with stress could lead to more DRX grains during creep.