Improvement of oxidation resistance of copper by atomic layer deposition

► Deposition of Al2O3 films on pure copper by an atomic layer deposition (ALD) technique. ► Analysis of properties of the films coated at various substrate temperatures using the ALD technique. ► Identification of the improvement of oxidation resistance of pure copper by the ALD-Al2O3 films. ► Assessment of the durability of the ALD-Al2O3 films by adhesion strength.