Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

The application of microporous sintered silver (Ag) as a bonding material to replace conventional die-bonding materials in power electronic devices has attracted considerable interest. Characterization of the mechanical properties of microporous Ag will enable its use in applications such as lead-free solder electronics and provide a fundamental understanding of its design principles. However, the material typically suffers from thermal and mechanical stress during its production fabrication, and service. In this work, we have studied the effect of microporous Ag specimen size on fracture toughness from the microscale to the macroscale. A focused ion beam was used to fabricate 20-, 10- and 5-μm-wide microscale specimens, which were of the same order of magnitude as the pore networks in the microporous Ag. Micro-cantilever bending tests revealed that fracture toughness decreased as the specimen size decreased. Conventional middle-cracked tensile tests were performed to determine the fracture toughness of the macroscale specimens. The microscale and macroscale fracture toughness results showed a clear size effect, which is discussed in terms of both the deformation behavior of crack tip and the influence of pore networks within Ag with different specimen sizes. Finite element model simulations showed that stress at the crack tip increased as the specimen size increased, which led to larger plastic deformation and more energy being consumed when the specimen fractured.

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