کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7137544 | 1461895 | 2014 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings
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موضوعات مرتبط
مهندسی و علوم پایه
شیمی
الکتروشیمی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Lab-on-a-chip (LOC) devices have enabled significant advancements in medical, biological, and chemical analysis. However, widespread adoption of these devices in, clinical settings and academic environments has been impeded by a lack of a reliable, adaptable, and easy-to-use packaging technology. In this work, we introduce a rapid, prototyped modular microfluidic interconnect that addresses these challenges of the, world-to-chip interface. The interconnect, a flexible polymer gasket co-printed with, rigid clamps, eliminates adhesives and additional assembly by direct multi-material 3D, printing from a computer-aided design model. The device represents the first, application of multi-material 3D printing to microfluidic interconnects, and it can be, rapidly re-designed and printed, and has demonstrated the ability to withstand, pressures exceeding 400Â kPa.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Sensors and Actuators A: Physical - Volume 205, 1 January 2014, Pages 199-203
Journal: Sensors and Actuators A: Physical - Volume 205, 1 January 2014, Pages 199-203
نویسندگان
O.H. Paydar, C.N. Paredes, Y. Hwang, J. Paz, N.B. Shah, R.N. Candler,