Keywords: اتصالات; Monolithic solar module; Geometry; Active area; Interconnects; Simulation; Resistive power loss; Diode equation
مقالات ISI ترجمه شده اتصالات
مقالات ISI اتصالات (ترجمه نشده)
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Keywords: اتصالات; Bare die; Flip-chip devices; Interconnects; Laser-induced forward transfer (LIFT); Laser material processing; Surface mounting;
Keywords: اتصالات; Interconnects; Printed electronics; Breakdown;
Keywords: اتصالات; Direct write; Interconnects; Rheology; Wear sensor; Printed electronics; Ink dispensing; Narrow interconnects;
Keywords: اتصالات; Interconnects; Multilayer graphene; Few-layer graphene; Contact resistance; Top contacts; Edge contacts; Sheet resistance; Mean free path;
Keywords: اتصالات; Multilayer graphene nanoribbons; Interconnects; Circuit modeling; Multi transmission line method; Transfer matrix model; Nyquist stability; Step time response;
The oxidation resistance optimization of titanium carbide/hastelloy (Ni-based alloy) composites applied for intermediate-temperature solid oxide fuel cell interconnects
Keywords: اتصالات; Solid oxide fuel cell; Interconnects; Titanium carbide/hastelloy composite; Particle size; Oxidation resistance;
Keywords: اتصالات; Self-assembly; Fullerene; Graphene; Copper; Interconnects;
Keywords: اتصالات; Graphene; Interconnects; Contact resistance; Mean free path
Keywords: اتصالات; Crosstalk; Overshoot/undershoot; Multilayer Graphene Nano Ribbon (MLGNR); Interconnects; ABCD parameter; Specular; Neutral; Gate oxide failure rate; AFR; Gate oxide reliability; Integrated circuit
Keywords: اتصالات; Sputtering; Tungsten; Thin film; Magnetic memories; Interconnects; Microstructure; Resistivity;
Keywords: اتصالات; Multilayer graphene nanoribbon (MLGNR); Interconnects; Transmission line model (TLM); Nichols chart; Crosstalk
Keywords: اتصالات; Solid oxide fuel cells (SOFC); Anode; Yttria stabilized zirconia (YSZ); Solid electrolyte; Cathode; Interconnects; Sealant; Structure; Material degradation;
Keywords: اتصالات; Tungsten; Resistivity size effect; Thin films; Interconnects
Keywords: اتصالات; Kinetic ınductance; Quantum capacitance; Fermi velocity; Graphene nanoribbons; Interconnects; Ab ınitio calculations;
Keywords: اتصالات; Platinum; Plating; Interconnects; Flexible; Implantable; Devices
Keywords: اتصالات; Carbon nanotubes; Interconnects; CNT shell density; DRAM
Keywords: اتصالات; SOEC; Interconnects; Cr vaporization; Coating; Ferritic steel 441;
Keywords: اتصالات; Interconnects; Compact Electro-thermal Model; Nonlinear Model Order Reduction; Volterra׳s series
Keywords: اتصالات; VLSI design migration; Layout compaction; Interconnects; Design hierarchy; Cell-based design
Keywords: اتصالات; 430 stainless steel; Cobalt electrodeposition; Interconnects; SOFC;
Keywords: اتصالات; Atomic layer deposition; Copper; Plasma; Interconnects; Aminoalkoxides; Nucleation;
A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression
Keywords: اتصالات; Prognostics; Interconnects; Solder joint reliability; Time domain reflectometry;
Mitigation of chromium poisoning of cathodes in solid oxide fuel cells employing CuMn1.8O4 spinel coating on metallic interconnect
Keywords: اتصالات; Solid oxide fuel cells; Cathode; Chromium poisoning; Copper manganese spinel coatings; Interconnects; Degradation;
On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers
Keywords: اتصالات; Self-assembled monolayers; Manganese silicate; XPS; Low-k dielectric; Interconnects;
Nickel substituted CuMn2O4 spinel coatings for solid oxide fuel cell interconnects
Keywords: اتصالات; SOFC; Spinel coatings; Ni-Cu-Mn-O; Interconnects; Chromium poisoning; Electrical conductivity;
Promising cermets of TiN-Ni for intermediate temperature solid oxide fuel cell interconnects application
Keywords: اتصالات; TiN-Ni cermets; Solid oxide fuel cells; Interconnects; Electrical conductivity; Oxidation resistance;
Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
Keywords: اتصالات; Tungsten; Contact; Interconnects; Liner; Low resistance; PCRAM;
Protective-conducting coatings based on black glasses (SiOC) for application in Solid Oxide Fuel Cells
Keywords: اتصالات; Solid Oxide Fuel Cell; Interconnects; Black glasses; Oxycarbide; Dip-coating;
A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Keywords: اتصالات; Electromigration; Grain growth; Computer simulation; 2D; Copper; Interconnects; On-chip; Statistics; Parallel computing;
The direct growth of carbon nanotubes as vertical interconnects in 3D integrated circuits
Keywords: اتصالات; Carbon nanotubes; Integrated circuits; Interconnects; Transistors; CMOS; 3D integration; Chemical vapour deposition;
The adjustment of microstructure and properties of TiC/NiCr composites by Mo addition applied for intermediate-temperature solid oxide fuel cell interconnects
Keywords: اتصالات; Metal-matrix composites; Microstructure; Properties; SOFC; Interconnects;
Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding
Keywords: اتصالات; Cu flake; Surface treatment; Ag particles; Sintering; Oxidation resistance; Interconnects
Promising metal matrix composites (TiC/Ni–Cr) for intermediate-temperature solid oxide fuel cell (SOFC) interconnect applications
Keywords: اتصالات; TiC/Ni–Cr composites; Microstructure; Thermal expansion; SOFC; Interconnects
Mn1.4Co1.4Cu0.2O4 spinel protective coating on ferritic stainless steels for solid oxide fuel cell interconnect applications
Keywords: اتصالات; Solid oxide fuel cell; Interconnects; Spinel coating; Long-term stability;
Reduced long term electrical resistance in Ce/Co-coated ferritic stainless steel for solid oxide fuel cell metallic interconnects
Keywords: اتصالات; Metallic coating; SOFC; Interconnects; Stainless steel; Conductivity; ASR
Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
Keywords: اتصالات; Laser induced forward transfer (LIFT) printing; Surface mount technology (SMT); System-in-foil (SiF); Conductive adhesive; Interconnects; Reliability
Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects
Keywords: اتصالات; Plasma enhanced atomic layer deposition; Ruthenium; Interconnects; Barrier
Effect of coatings on long term behaviour of a commercial stainless steel for solid oxide electrolyser cell interconnect application in H2/H2O atmosphere
Keywords: اتصالات; High temperature electrolysis; Hydrogen; Interconnects; Ferritic steels; Perovskite and spinel coatings;
Effect of layout on electromigration characteristics in copper dual damascene interconnects
Keywords: اتصالات; Electromigration; Interconnects; Copper; Layout
Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings
Keywords: اتصالات; 3D-printing; Microfluidics; Interconnects; Packaging; Polydimethylsiloxane (PDMS), Customizable;
The effect of doping (Mn,B)3O4 materials as protective layers in different metallic interconnects for Solid Oxide Fuel Cells
Keywords: اتصالات; Solid Oxide Fuel Cell; Interconnects; Chromium poison; Protective coating layer; Electrical contact resistance;
Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment
Keywords: اتصالات; Electromigration; Wafer level; Package level; Interconnects; Copper; Reliability
Nanoparticles and plasmon resonance based probe for failure analysis of ULSI microchips and electrical characterizations of metallic interconnects
Keywords: اتصالات; Failure analysis; Interconnects; Nanoparticles; Plasmon resonance; Surface enhanced raman scattering
Synthesis of carbon nanotubes and graphene for VLSI interconnects
Keywords: اتصالات; Interconnects; Carbon nanotubes; Graphene; Chemical vapour deposition
Electrical and reliability characterization of CuMn self forming barrier interconnects on low-k CDO dielectrics
Keywords: اتصالات; Interconnects; CuMn; Self-forming; Barrier; Sfb; Reliability; Bottom-less via
Ultimate limits of conventional barriers and liners-implications for the extendibility of copper metallization
Keywords: اتصالات; Metallization; Barriers; Copper; Interconnects
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
Keywords: اتصالات; Interconnects; Ultra-low-k materials; Process integration
Effects of changes in MOLB-type SOFC cell geometry on temperature distribution and heat transfer rate in interconnects
Keywords: اتصالات; Interconnects; MOLB-type SOFC; Temperature distribution; Flow uniformity; Thermo-fluid model; Solid oxide fuel cell;
GPGPU accelerated Krylov methods for compact modeling of on-chip passive integrated structures within the Chameleon-RF workflow
Keywords: اتصالات; Scientific computing; GPGPU acceleration; Interconnects; Iterative methods; Reduced order systems