Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Intermetallics - Volume 93, February 2018, Pages 186-196

Anil Kunwar, Bingfeng Guo, Shengyan Shang, Peter RÃ¥back, Yunpeng Wang, Jun Chen, Haitao Ma, Xueguan Song, Ning Zhao,