Keywords: C. پیوستن; A. Shape-memory alloys; A. Thin films and multilayers; B. In situ; B. Phase transformation; C. Heat treatment; C. Joining;
مقالات ISI C. پیوستن (ترجمه نشده)
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Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
Keywords: C. پیوستن; A. Intermetallics; B. Anisotropy; C. Joining; D. Microstructure; E. Finite-element modeling; F. Electron microscopy, scanning;
Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn,Ni) diffusion couples with various Ni additions
Keywords: C. پیوستن; A. Intermetallics; C. Joining; D. Microstructure; F. Electron microscopy, scanning; F. Electron microscopy, transmission;
Diffusion bonding of a Zr-based metallic glass in its supercooled liquid region
Keywords: C. پیوستن; B. Glasses, metallic; C. Joining; F. Mechanical testing;
Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars
Keywords: C. پیوستن; A. Multiphase intermetallics; B. Bonding; C. Joining; D. Phase interfaces; F. Mechanical testing
Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging
Keywords: C. پیوستن; A. Intermetallics; B. Grain growth; C. Thin films; D. Grain boundaries, structure; C. Joining;
Effects of alloying elements in GH99 superalloy on microstructure evolution of reactive brazing TiAl/GH99 joints
Keywords: C. پیوستن; A. Titanium aluminides, based on TiAl; B. Bonding; C. Joining; D. Microstructure;
On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple
Keywords: C. پیوستن; A. Trialuminides; B. Diffusion; B. Phase transformation; C. Joining;
Temperature effects on liquid-state Sn/Co interfacial reactions
Keywords: C. پیوستن; A. Intermetallics, Miscellaneous; B. Bonding; B. Phase transformations; C. Joining;
A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Diffusion; C. Joining; D. Phase interfaces; E. Simulations, atomistic;
Up-scaling the size of TiAl components made via ingot metallurgy
Keywords: C. پیوستن; A. Titanium aluminides, based on TiAl; C. Isothermal forging; C. Joining; D. Microstructure; F. Mechanical testing;
An investigation of Ti-43Al-9V/Ti-6Al-4V interface by diffusion bonding
Keywords: C. پیوستن; A. Titanium aluminides, based on TiAl; C. Joining; D. Microstructure; B. Thermal stability; E. Phase stability, prediction
Microstructure evolution and mechanical properties of transient liquid phase (TLP) bonded joints of TiAl intermetallics
Keywords: C. پیوستن; A. Titanium aluminides, based on TiAl; B. Bonding; C. Joining; D. Microstructure; B. Mechanical properties at high temperatures; B. Mechanical properties at ambient temperature
In situ joining of titanium to SiC/Al composites by low pressure infiltration
Keywords: C. پیوستن; A. Metal matrix composites; C. Joining; E. Bending strength
Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Diffusion; C. Crystal growth; C. Joining; D. Microstructure
Microstructure and mechanical properties of dissimilar spot friction stir welded Zr55Cu30Al10Ni5 bulk metallic glass to pure copper
Keywords: C. پیوستن; B. Glasses, metallic; C. Joining; D. Microstructure
The preparation and mechanical properties of carbon–carbon/lithium–aluminum–silicate composite joints
Keywords: C. پیوستن; A. Composites; C. Joining; E. Mechanical
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Diffusion; B. Thermal properties; C. Joining
Intermetallic compounds and antiphase domains in Al/Mg compound casting
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; C. Casting; C. Joining; D. Defects: antiphase domains;
Intermetallic compound formation in Pd/Al multilayer thin films
Keywords: C. پیوستن; A. Aluminides; miscellaneous; B. Phase transformation; B. Thermal stability; C. Thin films; C. Joining
Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates
Keywords: C. پیوستن; A. Nanostructured intermetallics; B. Phase transformation; B. Phase identification; C. Joining; C. Thin films
The effect of tool rotational and traverse speed on friction stir weldability of AISI 430 ferritic stainless steels
Keywords: C. پیوستن; A. Ferrous metals and alloys; C. Joining; D. Welding
A deep eutectic point in quaternary Zr–Ti–Ni–Cu system and bulk metallic glass formation near the eutectic point
Keywords: C. پیوستن; A. Multiphase intermetallics; B. Alloy design; B. Glasses, metallic; B. Phase identification; C. Joining; C. Rapid solidification processing; D. Microstructure
Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Texture; C. Crystal growth; C. Joining; D. Microstructure
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Diffusion; C. Joining; F. Electron microscopy, scanning;
Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Texture; C. Crystal growth; C. Joining; D. Microstructure
Kinetic analysis of Ni5Zn21 growth at the interface between Sn–Zn solders and Ni
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformation; C. Joining
Mechanical milling of Ti-Ni-Si filler metal for brazing TiAl intermetallics
Keywords: C. پیوستن; A. Titanium aluminides, based on TiAl; B. Bonding; C. Joining; C. Mechanical alloying and milling; D. Microstructure;
The isothermal section of the Ni-Sn-Zn phase diagram at 873Â K
Keywords: C. پیوستن; A. Intermetallics; A. Ternary alloy systems; B. Phase diagrams; C. Joining; F. Electron microscopy, scanning;
Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformation; C. Joining
Magnetically-triggered heating of Fe-Al powders
Keywords: C. پیوستن; A. Iron aluminides; B. Magnetic properties; C. Mechanical alloying and milling; C. Joining; E. Ordering energies;
A new approach to joining of bulk copper using microwave energy
Keywords: C. پیوستن; C. Joining; F. Microstructure; G. X-ray analysis
The analysis of lock forming mechanism in the clinching joint
Keywords: C. پیوستن; C. Joining; C. Forming; D. Mechanical fastening
The high-temperature phase equilibria of the Ni-Sn-Zn system: Isothermal sections
Keywords: C. پیوستن; A. Ternary alloy systems; A. Multiphase intermetallics; B. Phase diagrams; B. Crystallography; C. Joining;
Low-temperature brazing of titanium by the application of a Zr-Ti-Ni-Cu-Bebulk metallic glass (BMG) alloy as a filler
Keywords: C. پیوستن; C. Joining; D. Microstructure; B. Glasses, metallic; B. Bonding; F. Corrosion behaviour;
Interdiffusion study in binary gold-tin system
Keywords: C. پیوستن; B. Diffusion; A. Intermetallic; D. Microstructure; C. Joining;
On the influence of boron-addition on TLP bonding time in a Ni3Al-based intermetallic
Keywords: C. پیوستن; A. Nickel aluminides, based on Ni3Al; C. Joining; G. Aero-engine components
Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Phase transformation; C. Joining; D. Microstructure; F. Microscopy, various
Sn/Ni–Co solid/solid interfacial reactions
Keywords: C. پیوستن; A. Intermetallics, Miscellaneous; B. Diffusion; B. Phase transformation; C. Joining
Interfacial reactions in Au/Sn/Cu sandwich specimens
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Diffusion; B. Phase transformation; C. Joining
Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformations; C. Joining;
Intermetallic formation in a Ti–Cu dissimilar joint brazed using a Zr-based amorphous alloy filler
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Phase transformations; C. Joining; D. Microstructure; F. Electron microscopy, scanning
Strong bonding of infrared brazed α2-Ti3Al and Ti-6Al-4V using Ti-Cu-Ni fillers
Keywords: C. پیوستن; A. Titanium aluminides, based on Ti3Al; B. Bonding; C. Joining; F. Electron microscopy, scanning; G. Aerospace constructional uses;
Sn–Bi–Fe thermodynamic modeling and Sn–Bi/Fe interfacial reactions
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Thermodynamic and thermochemical properties; C. Joining; E. Phase diagram, prediction
Evaluation the effects of edge banding type and thickness on the strength of corner joints in case-type furniture
Keywords: C. پیوستن; C. Joining; D. Bonding adhesive; H. Selection for material properties
High temperature reliability evaluation of CoSb3/electrode thermoelectric joints
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Thermal stability; C. Joining; G. Thermoelectric power generation
Investigation of the mechanical properties and microstructure of friction welded joints between AISI 4140 and AISI 1050 steels
Keywords: C. پیوستن; C. Joining; D. Welding; F. Microstructure
Investigations the effects of fastener, glue, and composite material types on the strength of corner joints in case-type furniture construction
Keywords: C. پیوستن; C. Joining; D. Bonding adhesive; H. Selection for material properties
Formation of amorphous Zr41.2Ti13.8Ni10Cu12.5Be22.5 coatings via the ElectroSpark Deposition process
Keywords: C. پیوستن; B. Glasses, metallic; C. Joining; C. Coatings, intermetallic and otherwise; F. Microscopy, various
Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210 °C
Keywords: C. پیوستن; A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformations; C. Joining;