Changes in the phase composition and structure of electrodeposited Sn-Co alloys in Sn-Co/Cu layer systems upon heating

►Sn-(0.24-26.5) wt.% Co alloy layers (5-10 μm) were electrodeposited on Cu substrate. ►Conditions tested included heating at 170 °C for 200 h followed by 20 h at 205 °C. ►Formation of Sn-Co intermetallics in the layers was dependent on the Co content. ►In the Sn-(11-26.5) wt. Co/Cu system, Cu6Sn5 and Cu3Sn did not form after heating.