کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9670520 | 1450403 | 2005 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Challenges in the implementation of low-k dielectrics in the back-end of line
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
The introduction of ultra low-k materials in copper technology has been much slower than anticipated in the ITRS Roadmap. The introduction of porosity in low-k materials has increased the level of complexity tremendously. In this paper, the challenges appearing during the integration of ultra low-k dielectrics will be discussed, since a proper understanding of these issues is essential for downscaling of the interconnect system. The inferior mechanical and thermal properties were always identified as main showstoppers for low-k integration. However, the extreme vulnerability of porous low-k to produces-induced damage (accompanied with the loss of dielectric performance and reliability) demands a continuous innovation of materials, processes and integration approaches.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 80, 17 June 2005, Pages 337-344
Journal: Microelectronic Engineering - Volume 80, 17 June 2005, Pages 337-344
نویسندگان
R.J.O.M. Hoofman, G.J.A.M. Verheijden, J. Michelon, F. Iacopi, Y. Travaly, M.R. Baklanov, Zs. Tökei, G.P. Beyer,