کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5019999 | 1468631 | 2017 | 25 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Digital light processing 3D printing of conductive complex structures
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
3D printing has gained significant research interest recently for directly manufacturing 3D components and structures for use in a variety of applications. In this paper, a digital light processing (DLP®) based 3D printing technique was explored to manufacture electrically conductive objects of polymer nanocomposites. Here, the ink was made of a mixture of photocurable resin with multi-walled carbon nanotubes (MWCNTs). The concentrations of MWCNT as well as the printing parameters were investigated to yield optimal conductivity and printing quality. We found that 0.3Â wt% loading of MWCNT in the resin matrix can provide the maximum electrical conductivity of 0.027S/m under the resin viscosity limit that allows high printing quality. With electric conductivity, the printed MWCNT nanocomposites can be used as smart materials and structures with strain sensitivity and shape memory effect. We demonstrate that the printed conductive complex structures as hollow capacitive sensor, electrically activated shape memory composites, stretchable circuits, showing the versatility of DLP® 3D printing for conductive complex structures. In addition, mechanical tests showed that the addition of MWCNT could slightly increase the modulus and ultimate tensile stress while decreasing slightly the ultimate stretch, indicating that the new functionality is not obtained at the price of sacrificing mechanical properties.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Additive Manufacturing - Volume 18, December 2017, Pages 74-83
Journal: Additive Manufacturing - Volume 18, December 2017, Pages 74-83
نویسندگان
Quanyi Mu, Lei Wang, Conner K. Dunn, Xiao Kuang, Feng Duan, Zhong Zhang, H. Jerry Qi, Tiejun Wang,