Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Polymeric composites have the potential to replace current electronic packaging and improve thermal management of electronics to open the way for further size shrinkage. Such composites need to provide high thermal conductivity and high electrical resistivity while possessing suitable mechanical properties. This paper reports the study of thermal behavior of arranged and random network of hexagonal boron nitride (hBN) in composite with different polymers. Thermal barrier factors and possible solutions to reduce the effect of these factors are thoroughly investigated. Thermal behavior of hBN filler network in composite with different polymers as well as the possibility of using green (bio-based) polymers as the matrix have been studied. Fully bio-based, partially bio-based and petroleum based composites are compared to investigate the effect of different polymer matrices on thermal properties of composites. Designed high thermally conductive and electrically insulative composites are expected to possess unique properties. This includes being lightweight, injection moldable, low coefficients of thermal expansion, eco-friendly, and with proper service temperature and mechanical properties. Such composites will result in more compact, lighter and cheaper electronics with higher performance, by avoiding the use of electrical fans, heat sinks and other methods of heat dissipation.