Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Tensile behavior of an electrodeposited Cu with ultrafine grain size of ∼200 nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility.