The effectiveness of thermal treatment for development of conductive metalized aramid fiber using supercritical fluid carbon dioxide-Fiber-metal adhesive strength improvement

► ScCO2/thermal treatment effectiveness for aramid fiber-Cu layer adhesion enhancement. ► ScCO2-loaded Pd(hfac)2 on aramid fiber surface annealing at 180 °C. ► Annealing caused fiber surface modification, Pd(hfac)2 diffusion and reduction. ► Pd diffusion increased fiber surface-Cu layer adhesion strength.