Thermal conductivity of diamond composites sintered under high pressures

Thermal conductivity at room temperature of diamond composites of two types: with a diamond skeleton and with diamond grains imbedded in a non-diamond matrix was evaluated in dependence of the diamond grain size (d) varied from a ten of microns to 500 μm. The thermal conductivity of the compacts with diamond skeleton obtained in the Cu–diamond system at high pressure of 8 GPa strongly increases with diamond particles size approaching the maximum value of 9 W/cm K at d ≈ 200 μm. The compacts sintered in the Cu–Ti–diamond, Al–Si–diamond and Si–diamond systems at lower pressure (2 GPa) are formed predominantly owing to the presence of the binder. It was found for these conditions that the thermal conductivity is less sensitive to the diamond grain size, reaching the value of 6 W/cm K for the composites with SiC–Si matrix.