The viewing angle dependency in the presence of wide field image viewing and its relationship to the evaluation indices Fulltext Access 10 Pages 2006
Thermal deformation measurements and predictions of MAP–BGA electronic packages Fulltext Access 11 Pages 2006
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Fulltext Access 11 Pages 2006
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser Fulltext Access 11 Pages 2006
Systematic derivation of explicit design formulae for log-domain: A 3rd-order lowpass example Fulltext Access 11 Pages 2006
An analytical model for discretized doped InAlAs/InGaAs heterojunction HEMT for higher cut-off frequency and reliability Fulltext Access 11 Pages 2006
Microstructuring of glassy carbon mold for glass embossing – Comparison of focused ion beam, nano/femtosecond-pulsed laser and mechanical machining Fulltext Access 11 Pages 2006
Deterministic end-to-end delay guarantees with rate controlled EDF scheduling Fulltext Access 11 Pages 2006
An integrated temporal partitioning and physical design framework for static compilation of reconfigurable computing systems Fulltext Access 11 Pages 2006
Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system Fulltext Access 11 Pages 2006
Transient fracturing of solder joints subjected to displacement-controlled impact loads Fulltext Access 11 Pages 2006
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection Fulltext Access 11 Pages 2006
The effect of die attach voiding on the thermal resistance of chip level packages Fulltext Access 11 Pages 2006
Implementation of plug-and-play ESD protection in 5.5 GHz 90 nm RF CMOS LNAs—Concepts, constraints and solutions Fulltext Access 11 Pages 2006
Study of CDM specific effects for a smart power input protection structure Fulltext Access 11 Pages 2006
A design flow for speeding-up dsp applications in heterogeneous reconfigurable systems Fulltext Access 11 Pages 2006
Evaluation of board-level reliability of electronic packages under consecutive drops Fulltext Access 11 Pages 2006
Experimental study and life prediction on high cycle vibration fatigue in BGA packages Fulltext Access 11 Pages 2006
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads Fulltext Access 11 Pages 2006
Support excitation scheme for transient analysis of JEDEC board-level drop test Fulltext Access 11 Pages 2006
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study Fulltext Access 11 Pages 2006
Fixed-point neural independent component analysis algorithms on the orthogonal group Fulltext Access 11 Pages 2006
A semantic approach to discovering learning services in grid-based collaborative systems Fulltext Access 11 Pages 2006
GMPLS-based service differentiation for scalable QoS support in all-optical Grid applications Fulltext Access 11 Pages 2006
Scheduling workflow applications on processors with different capabilities Fulltext Access 11 Pages 2006
Design optimization and space minimization considering timing and code size via retiming and unfolding Fulltext Access 11 Pages 2006
Evaluating architectures for independently auditing service level agreements Fulltext Access 11 Pages 2006
Finite element approximation to infinite Prandtl number Boussinesq equations with temperature-dependent coefficients—Thermal convection problems in a spherical shell Fulltext Access 11 Pages 2006
Large scale parallel FEM computations of far/near stress field changes in rocks Fulltext Access 11 Pages 2006
A universal performance factor for multi-criteria evaluation of multistage interconnection networks Fulltext Access 11 Pages 2006
Multi-domain Lambda Grid data portal for collaborative Grid applications Fulltext Access 11 Pages 2006
Using wait-free synchronization in the design of distributed applications Fulltext Access 11 Pages 2006
Power-aware out-of-order issue logic in high-performance microprocessors Fulltext Access 11 Pages 2006
An integrated admission control scheme for the delivery of streaming media Fulltext Access 11 Pages 2006
Complexity of matrix product on modular linear systolic arrays for algorithms with affine schedules Fulltext Access 11 Pages 2006
Stigmergic approaches applied to flexible fault-tolerant digital VLSI architectures Fulltext Access 11 Pages 2006
Initial approaches to the application of islands-based parallel EDAs in continuous domains Fulltext Access 11 Pages 2006
Utilizing unreliable public resources for higher profit and better SLA compliance in computing utilities Fulltext Access 11 Pages 2006
Scaling applications to massively parallel machines using Projections performance analysis tool Fulltext Access 12 Pages 2006
Effects of bonding force on contact pressure and frictional energy in wire bonding Fulltext Access 12 Pages 2006
A performance model of non-deterministic particle transport on large-scale systems Fulltext Access 12 Pages 2006
Development of a prototype detector for use in scintimammography imaging Fulltext Access 12 Pages 2006
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition Fulltext Access 12 Pages 2006
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria Fulltext Access 12 Pages 2006
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection Fulltext Access 12 Pages 2006
Interfacial thermal stresses in solder joints of leadless chip resistors Fulltext Access 12 Pages 2006
An overview of feed-forward design techniques for high-gain wideband operational transconductance amplifiers Fulltext Access 12 Pages 2006
Circuit models for quasi-3D spice simulation of turn-on transients in four-layer power bipolar devices Fulltext Access 12 Pages 2006
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers Fulltext Access 12 Pages 2006
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures Fulltext Access 12 Pages 2006
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading Fulltext Access 12 Pages 2006
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip Fulltext Access 12 Pages 2006
Drop impact reliability testing for lead-free and lead-based soldered IC packages Fulltext Access 12 Pages 2006
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages Fulltext Access 12 Pages 2006
Thermally induced deformation of solder joints in real packages: Measurement and analysis Fulltext Access 12 Pages 2006