Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications Fulltext Access 6 Pages 2006
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current Fulltext Access 6 Pages 2006
NBT stress-induced degradation and lifetime estimation in p-channel power VDMOSFETs Fulltext Access 6 Pages 2006
Electrical parameters degradation of power RF LDMOS device after accelerated ageing tests Fulltext Access 6 Pages 2006
Effect of a buffer layer in the epi-substrate region to boost the avalanche capability of a 100V Schottky diode Fulltext Access 6 Pages 2006
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions Fulltext Access 6 Pages 2006
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling Fulltext Access 6 Pages 2006
Thermal characterization and modeling of power hybrid converters for distributed power systems Fulltext Access 6 Pages 2006
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis Fulltext Access 6 Pages 2006
AlGaN/GaN HEMT Reliability Assessment by means of Low Frequency Noise Measurements Fulltext Access 6 Pages 2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions Fulltext Access 6 Pages 2006
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect Fulltext Access 6 Pages 2006
Characterization of hafnium oxide grown on silicon by atomic layer deposition: Interface structure Fulltext Access 6 Pages 2006
A field-effect electron mobility model for SiC MOSFETs including high density of traps at the interface Fulltext Access 6 Pages 2006
Electrochemical corrosion effects and chemical mechanical polishing characteristics of tungsten film using mixed oxidizers Fulltext Access 6 Pages 2006
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure Fulltext Access 6 Pages 2006
Reliability of Pb(Mg,Nb)O3–Pb(Zr,Ti)O3 multilayer ceramic piezoelectric actuators by Weibull method Fulltext Access 6 Pages 2006
Distributed collaborative design of IP components in the TRMS environment Fulltext Access 6 Pages 2006
Life margin assessment with Physics of Failure Tools application to BGA packages Fulltext Access 6 Pages 2006
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology Fulltext Access 6 Pages 2006
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems Fulltext Access 6 Pages 2006
Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions Fulltext Access 6 Pages 2006
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride Fulltext Access 6 Pages 2006
Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs Fulltext Access 6 Pages 2006
Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors Fulltext Access 6 Pages 2006
Optimizing the controller IC for micro HDD process based on Taguchi methods Fulltext Access 6 Pages 2006
A new symmetrical double gate nanoscale MOSFET with asymmetrical side gates for electrically induced source/drain Fulltext Access 6 Pages 2006
Test structure assembly for bump bond yield measurement on high density flip chip technologies Fulltext Access 6 Pages 2006
Study of dc conduction mechanisms in dysprosium–manganese oxide insulator thin films grown on Si substrates Fulltext Access 6 Pages 2006
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications Fulltext Access 6 Pages 2006
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition Fulltext Access 6 Pages 2006
Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps Fulltext Access 6 Pages 2006
Improved physical understanding of intermittent failure in continuous monitoring method Fulltext Access 6 Pages 2006
Study of X-ray lithographic conditions for SU-8 by Fourier transform infrared spectroscopy Fulltext Access 6 Pages 2006
New techniques to characterize properties of advanced dielectric barriers for sub-65 nm technology node Fulltext Access 6 Pages 2006
A comparative study of nickel silicides and nickel germanides: Phase formation and kinetics Fulltext Access 6 Pages 2006
Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting Fulltext Access 6 Pages 2006
Electroless deposition of CoWP: Material characterization and process optimization on 300 mm wafers Fulltext Access 6 Pages 2006
Critical failure ORC: Improving model accuracy through enhanced model generation Fulltext Access 6 Pages 2006
Zone-plate-array lithography: A low-cost complement or competitor to scanning-electron-beam lithography Fulltext Access 6 Pages 2006
UV curing effects on mechanical and electrical performances of a PECVD non-porogen porous SiOC:H films (in k [2.2–2.4] range) for 45 nm node and below Fulltext Access 6 Pages 2006
A two-dimensional circumplex approach to the development of a hacker taxonomy Fulltext Access 6 Pages 2006
Arriving at an anti-forensics consensus: Examining how to define and control the anti-forensics problem Fulltext Access 6 Pages 2006
Characterization of electron beam evaporated ZnO thin films and stacking ZnO fabricated by e-beam evaporation and rf magnetron sputtering for the realization of resonators Fulltext Access 6 Pages 2006
Optically variable micro-mirror arrays fabricated by graytone lithography Fulltext Access 6 Pages 2006
The improvement of thermal stability of nickel silicide by adding a thin Zr interlayer Fulltext Access 6 Pages 2006
Simulation of nanoscale MOSFETs using modified drift-diffusion and hydrodynamic models and comparison with Monte Carlo results Fulltext Access 6 Pages 2006
Relevance of the pulsed capacitance–voltage measurement technique for the optimization of SrBi2Ta2O9/high-k stack combination to be used in FeFET devices Fulltext Access 6 Pages 2006
Effect of margin widths on the residual stress in a multi-layer ceramic capacitor Fulltext Access 6 Pages 2006
Compatibility of HfxTayN metal gate electrode with HfOxNy gate dielectric for advanced CMOS technology Fulltext Access 6 Pages 2006
The parametric study of carbon nanotips grown by MWPECVD with controllable sharpness using various metallic catalysts Fulltext Access 6 Pages 2006
Electron beam induced SiO2 etch selectivity and its application to oxide nano-aperture formation Fulltext Access 6 Pages 2006
Efficient algorithm for placing a given number of base stations to cover a convex region Fulltext Access 6 Pages 2006
Annealing effects on the properties of HfO2 films grown by metalorganic molecular beam epitaxy Fulltext Access 6 Pages 2006
The effect of Ho doping on the microstructure and optical properties of Ba0.65Sr0.35TiO3 thin films Fulltext Access 6 Pages 2006
Experimental measurements of electron scattering parameters in Cu narrow lines Fulltext Access 6 Pages 2006
Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection Fulltext Access 6 Pages 2006
Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging Fulltext Access 6 Pages 2006
Impact of an As implant before CoSi2 formation on the sheet resistance and junction breakdown voltage Fulltext Access 6 Pages 2006
Impact of TiN post-treatment on metal insulator metal capacitor performances Fulltext Access 6 Pages 2006
Characterization of electrical and crystallographic properties of metal layers at deca-nanometer scale using Kelvin probe force microscope Fulltext Access 6 Pages 2006
Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects Fulltext Access 6 Pages 2006