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Daneshyari Hardware and Architecture Journas Latest Articles

Hardware and Architecture Research Articles

Effect of RuO2 electrode on laser-MBE prepared HfO2 gate dielectrics
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Gate voltage and oxide thickness dependence of progressive wear-out of ultra-thin gate oxides
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Localization and physical analysis of a complex SRAM failure in 90nm technology
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Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity
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Time gating imaging through thick silicon substrate: a new step towards backside characterisation
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On the profile of temperature dependent series resistance in Al/Si3N4/p-Si (MIS) Schottky diodes
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Sacrificial film-assisted nanoimprint lithography
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Fabrication of various curved relief structures through concave surface forming and soft replica molding
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Diffusion barrier performance of W/Ta–W–N double layers for Cu metallization
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Fabrication of multi-dimensional colloid crystals on raised surfaces via reversal nanoimprint lithography
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High density of electrodeposited Sn/Ag bumps for flip chip connection
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Analysis of HSG-7000 silsesquioxane-based low-k dielectric hot plate curing using Raman spectroscopy
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Effect of the spatial distribution of SiO2 thickness on the switching behavior of bistable MOS tunnel structures
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Post-breakdown leakage resistance and its dependence on device area
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Determination of swing curve “shifts” as a function of illumination conditions: Impact on the CD uniformity
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Fabrication of nano-sized resist patterns on flexible plastic film using thermal curing nano-imprint lithography
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Inkjet printed silver source/drain electrodes for low-cost polymer thin film transistors
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Nitridation of hafnium oxide by reactive sputtering
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Dielectric spectroscopy studies on (PVP + PVA) polyblend film
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Study of ultrathin vanadium nitride as diffusion barrier for copper interconnect
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Thermal analysis for step and flash imprint lithography during UV curing process
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Frequency dependent capacitance and conductance–voltage characteristics of Al/Si3N4/p-Si(1 0 0) MIS diodes
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Fabrication of PDMS (polydimethylsiloxane) microlens and diffuser using replica molding
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Vertically aligned GaN nanotubes – Fabrication and current image analysis
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Template synthesis of carbon nanotubes from porous alumina matrix on silicon
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Failure Analysis-assisted FMEA
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Temperature effects on DC and small signal RF performance of AlGaAs/GaAs HEMTs
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Effect of reverse substrate bias on ultra-thin gate oxide n-MOSFET degradation under different stress modes
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Study of the power capability of LDMOS and the improved methods
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On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials
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Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
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Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs
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Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol–gel method with catalyst HF
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Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler–Nordheim electron injection
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Stabilized emission from micro-field emitter for electron microscopy
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Reliability of high temperature solder alternatives
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Device level electrical-thermal-stress coupled-field modeling
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Dynamic voltage stress effects on nMOS varactor
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Low temperature plasma carbon nanotubes growth on patterned catalyst
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Kelvin probe force microscopy – An appropriate tool for the electrical characterisation of LED heterostructures
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Impact on the back gate degradation in partially depleted SOI n-MOSFETs by 2-MeV electron irradiation
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High brightness GaN LEDs degradation during dc and pulsed stress
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Strong electron irradiation hardness of 852 nm Al-free laser diodes
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Charging-Effects in RF capacitive switches influence of insulating layers composition
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Charging of radiation induced defects in RF MEMS dielectric films
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Novel ESD strategy for high voltage non-volatile programming pin application
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Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect
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The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
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Development of highly accelerated electromigration test
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Transient-induced latch-up test setup for wafer-level and package-level
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Simulation of DOE fabrication using DMD-based gray-tone lithography
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Selective deposition of CVD iron on silicon dioxide and tungsten
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CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters
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Impact of narrow trench geometries on copper film crystallography
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Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
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Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives
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Correlation between trench depth and TDDB thermal activation energy in single damascene Cu/SiOC:H
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Self-aligned multi-level air gap integration
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Phase effects and short gate length device implementation of Ni fully silicided (FUSI) gates
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Different approaches to integrate patterned buried CoSi2 layers in SOI substrates
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A novel self-aligned process for platinum silicide nanowires
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Density functional study of the stability and electronic properties of TaxNy compounds used as copper diffusion barriers
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Dependence of CMP-induced delamination on number of low-k dielectric films stacked
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Chemical mechanical polishing of PZT thin films for FRAM applications
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Lithographic manufacturing robustness analysis for as drawn patterns
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Status and future of maskless lithography
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Methods to reduce lithography costs with reticle engineering
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Superhydrophobic surfaces fabricated by nanoimprint lithography
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Characterization of imprinting polymeric temperature variation with fluorescent Rhodamine B molecule
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Optical heating for short hot embossing cycle times
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Multibeam electron source for nanofabrication using electron beam induced deposition
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Nanoscale imaging with a portable field emission scanning electron microscope
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Transitioning of direct e-beam write technology from research and development into production flow
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A new mask blank deposition tool
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From hyper NA to low NA
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Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity
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Capacitance non-linearity study in Al2O3 MIM capacitors using an ionic polarization model
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A novel approach to resistivity and interconnect modeling
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Electrical properties and thermal stability of MOCVD grown Ru gate electrodes for advanced CMOS technology
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Material and electrical characterization of TMS-based silicidation of the Cu-dielectric barrier interface for electromigration improvement of 65 nm interconnects
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Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure
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Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps
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Evidence for metastable defects in airgap interconnects
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AC impedance analysis of Au/porous silicon contacts
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Influence of mass density and mechanical properties on the surface acoustic wave velocity dispersion
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Properties of 50 nm electroless films Ag–W–oxygen before and after low temperature, low activation energy resistivity decay
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Measuring the Young’s modulus of ultralow-k materials with the non destructive picosecond ultrasonic method
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High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits
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Nanoelectronics beyond silicon
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Study of the post-etch cleaning compatibility with dense and porous ULK materials – characterization of the process impact
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Characterization of the impact of plasma treatments and wet cleaning on a porous low k material
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Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach
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Impact of dummies on interconnects network HF propagation performances for the 65 nm node
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Quantification of processing damage in porous low dielectric constant films
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Tuning nickel silicide properties using a lamp based RTA, a heat conduction based RTA or a furnace anneal
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Growth of Ru/RuO2 layers with atomic vapor deposition on plain wafers and into trench structures
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Electrical properties of epitaxial NiSi2/Si contacts with extremely flat interface formed in Ni/Ti/Si(0 0 1) system
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In situ study of the growth kinetics and interfacial roughness during the first stages of nickel–silicide formation
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A new RuO4 solvent solution for pure ruthenium film depositions
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Microstructure and material properties of electroless CoWP films obtained from sulfamate solutions
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