Forensic smartphone analysis using adhesives: Transplantation of Package on Package components

This work overcomes this difficulty by introducing a new chip-off analysis method based on High Temperature Thixotropic Thermal Conductive Adhesive (HTTTCA) for gluing the PoP packages to prevent misalignment during the transplantation process. The HTTTCA process allows the investigator to safely unsolder PoP components, which is a crucial step for transplantation. To demonstrate feasibility, we describe in detail an experimental forensic transplantation of a secure mobile phone PoP CPU.