Dynamic characterization of silicon-based microstructure of high aspect ratio by dual-prism UV laser system

In this paper, a 355 nm UV Nd:YAG laser with a dual-prism optical system is used to fabricate silicon-based spiral microstructures with high aspect ratio. The cutting linewidth of the laser beam can be controlled by this dual-prism optical system from some microns to hundreds of microns. A laser direct writing method provides many advantages such as independence of the crystal orientation of the silicon wafer and fast fabrication for prototyping. The experimental results show that silicon-based arbitrary-shaped microstructures can be fabricated by this optical system. Spiral microstructures of an aspect ratio up to 10 can be obtained, which can be used as a vibrational structure for MEMS applications. The dynamic characteristics of the spiral microstructures are tested and analyzed. In this study, finite element software ANSYS is used to simulate the dynamic characteristics of the spiral microstructure. Besides, a vibration testing system is set up to measure the dynamic characteristics of the spiral microstructures. The measured data show good agreement with the simulation results.