کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
11028193 | 1663923 | 2019 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves
ترجمه فارسی عنوان
تجزیه و تحلیل کمی از حفره ها در ساختارهای چند لایه بر اساس امواج اولتراسونیک لیزر منتقل شده
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کلمات کلیدی
ساختار لنگر سونوگرافی لیزر، خالی، خصوصیات کمی،
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی عمران و سازه
چکیده انگلیسی
A laser ultrasonic method based on transmission has been investigated to characterize voids in the bonded layer and its corresponding quantitative strategy has been proposed to feed back accurate manufacturing information on multi-layer metal bonded structures. Characteristics of laser ultrasonic waves obtained at epicentre in a bonded joint were analyzed and interaction of laser ultrasound with voids in the bonded layer was explained with aids of simulation results and experimental data. The longitudinal wave amplitude gradually increases and then decreases with the increase of distances off epicentre, while the shear wave amplitude shows a monotonic decline with distances off epicentre rising. Moreover, the relative sensitivity has been proposed to quantitatively measure the sizes of voids and its variation is from â2.48âdB to â2.44âdB with defects of 3âmm to 15âmm in diameter. The laser ultrasonic C-scan result based on shear waves with transmission can find the small void with 3âmm size and other natural defects. The proposed quantitative method is effective for measurement of void sizes. As a result, laser ultrasonic C-scans on basis of transmitted shear waves jointed with the proposed quantitative method have great potential for quantitative characterization of voids in bonded structures.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Archives of Civil and Mechanical Engineering - Volume 19, Issue 1, March 2019, Pages 79-90
Journal: Archives of Civil and Mechanical Engineering - Volume 19, Issue 1, March 2019, Pages 79-90
نویسندگان
Kuanshuang Zhang, Shicheng Li, Zhenggan Zhou,