کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1116640 1488430 2014 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Wire Bond Shear Test Simulation on Flat Surface Bond Pad
ترجمه فارسی عنوان
سیم باند سیم برشی تست بر روی سطح صاف باند پد؟
موضوعات مرتبط
علوم انسانی و اجتماعی علوم انسانی و هنر هنر و علوم انسانی (عمومی)
چکیده انگلیسی

The reliability and the bond strength of wire bonding electronic packages are appraised using wire bond shear test. In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test on a flat surface bond pad. Comparisons between three types of wire material:gold (Au), aluminium (Al) and copper (Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminium and gold wire bond during wire bond shear test.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Procedia - Social and Behavioral Sciences - Volume 129, 15 May 2014, Pages 328-333