کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1116653 | 1488430 | 2014 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Polymer Core BGA Stress Analysis at Higher Vertical Loading
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موضوعات مرتبط
علوم انسانی و اجتماعی
علوم انسانی و هنر
هنر و علوم انسانی (عمومی)
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چکیده انگلیسی
Due to the miniaturization trend of the integrated circuit (IC), the ball grid array is an main interconnection method used for semiconductor packaging. Improving the reliability of the solder ball is gaining a significant pace as new materials are utilized to replace existing materials. Therefore, in this study, the stress response of BGA solder with different material during maximum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The simulation is done using ANSYS version 11. The results obtained show that the Normal BGA demonstrates higher stress response compared to the Micropearl BGA.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Procedia - Social and Behavioral Sciences - Volume 129, 15 May 2014, Pages 430-435
Journal: Procedia - Social and Behavioral Sciences - Volume 129, 15 May 2014, Pages 430-435