Encapsulation of a pressure sensitive adhesive by spray-cooling: Optimum formulation and processing conditions

• A water-based adhesive was encapsulated by spray-cooling using hydrogenated palm oil.
• A screening design methodology was used to evaluate the impact of some factors.
• Formulation and process variables impact on the particles properties was studied.
• The statistical analysis showed process parameters have negligible impact.
• The heating temperature, the adhesive and surfactant ratios were the major factors.

An industrial pressure sensitive adhesive (PSA) was encapsulated by spray-cooling using hydrogenated palm oil. A screening design methodology was used to evaluate the impact of some formulation and process variables on the particle properties. Six operating factors were retained and the results considered were the production yield, the particle volume-surface average diameter D32, the residual humidity, the ratio of the fusion enthalpies of the polymorphs α and β′/β and the normalized peeling force. The statistical analysis of the results showed a negligible impact of the parameters related to the process. The heating temperature, the PSA and surfactant ratios were the most significant factors. It was possible to produce spherical particles with a mean size of 17.7 μm and a normalized peeling force of 0.218 N m2/g. The production yield was 70%. A duplicate test confirmed the results. Mechanical tests on unitary particles showed an increase of the rupture and adhesion forces with particle size.

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