Novel Low-Temperature-Sintering Type Cu-Alloy Pastes for Silicon Solar Cells

This paper describes a novel Cu paste for low temperature sintering, which is required to fabricate electrodes on transparent conductive films in heterojunction solar cells. For this, glass-fritless Cu-alloy pastes containing a low melting point alloy (LMPA) were prepared. The pastes were evaluated in terms of printability, contact resistance, line resistance, adhesive property, diffusion of Cu in Si, and oxidation resistance. It was concluded that the pastes could be applicable to silicon solar cells requiring low temperature processes.