کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1696860 | 1519233 | 2016 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: A molecular dynamics simulation investigation
ترجمه فارسی عنوان
تأثیر دما بر رفتار برش بیرونی بر روی سیلیکون تک بلوری: بررسی شبیه سازی دینامیکی مولکولی
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کلمات کلیدی
دینامیک مولکولی، سیلیکون کریستال تک، ناهمسانگردی، دمای برش،
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
چکیده انگلیسی
Using molecular dynamics (MD) simulation, this paper investigates anisotropic cutting behaviour of single crystal silicon in vacuum under a wide range of substrate temperatures (300Â K, 500Â K, 750Â K, 850Â K, 1173Â K and 1500Â K). Specific cutting energy, force ratio, stress in the cutting zone and cutting temperature were the indicators used to quantify the differences in the cutting behaviour of silicon. A key observation was that the specific cutting energy required to cut the (1Â 1Â 1) surface of silicon and the von Mises stress to yield the silicon reduces by 25% and 32%, respectively, at 1173Â K compared to what is required at 300Â K. The room temperature cutting anisotropy in the von Mises stress and the room temperature cutting anisotropy in the specific cutting energy (work done by the tool in removing unit volume of material) were obtained as 12% and 16%, respectively. It was observed that this changes to 20% and 40%, respectively, when cutting was performed at 1500Â K, signifying a very strong correlation between the anisotropy observed during cutting and the machining temperature. Furthermore, using the atomic strain criterion, the width of primary shear zone was found to vary with the orientation of workpiece surface and temperature i.e. it remains narrower while cutting the (1Â 1Â 1) surface of silicon or at higher machining temperatures. A major anecdote of the study based on the potential function employed in the study is that, irrespective of the cutting plane or the cutting temperature, the state of the cutting edge of the diamond tool did not show direct diamond to graphitic phase transformation.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Manufacturing Processes - Volume 23, August 2016, Pages 201-210
Journal: Journal of Manufacturing Processes - Volume 23, August 2016, Pages 201-210
نویسندگان
Saeed Zare Chavoshi, Saurav Goel, Xichun Luo,