کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1696937 1012026 2015 11 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Multi-physics modeling for laser micro-transfer printing delamination
ترجمه فارسی عنوان
مدل سازی چند فیزیک برای لایه برداری میکرو انتقال لیزر
کلمات کلیدی
چاپ میکرو انتقال، میکرو مونتاژ لیزر، الکترونیک انعطاف پذیر، خواص لیزر، مکانیک شکستگی، مدل سازی چند فیزیک
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی صنعتی و تولید
چکیده انگلیسی

Micro-transfer printing technology is rapidly emerging as an effective pathway for large-scale heterogeneous materials integration. In its basic embodiment, micro-transfer printing is used to deterministically transfer and micro-assemble prefabricated structures/devices, referred to as “ink,” from a donor substrate to a receiving substrate using a viscoelastic elastomer stamp, usually made out of polydimethylsiloxane (PDMS). Laser Micro Transfer Printing (LMTP) is a laser-driven non-contact variant of the process that makes it independent of the receiving substrate's properties, geometry, and preparation. In this paper, an opto-thermo-mechanical model is developed to understand how the laser beam energy is converted to thermally-induced strains around the ink-stamp interface to initiate the ink delamination process. The opto-thermo-mechanical model is developed based on decoupling the optical absorption physics from the thermo-mechanical model physics. An optical absorption model for the laser beam energy absorbed by the ink is first developed and verified experimentally to estimate the heating rates of the ink-stamp system, which in turn are used as an input for a couple thermo-mechanical Finite Element Analysis (FEA) model. Further, high speed camera recordings for LMTP delamination are used to calibrate the thermo-mechanical model and verify its predictions. Besides providing a fundamental understanding of the delamination mechanism and the LMTP process capabilities, the developed opto-thermo-mechanical model is useful in selecting process parameters (laser pulse duration, stand-off distance), estimating the ink-stamp temperature rise during the LMTP process, and quantifying and decomposing the stresses at the ink-stamp interface to its main sources (Coefficient of Thermal Expansion (CTE) mismatch and thermal gradient strains).

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Manufacturing Processes - Volume 20, Part 2, October 2015, Pages 414–424
نویسندگان
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