Thermal analysis of integrated spiral inductors

This paper presents the thermal analysis results of integrated spiral inductors. Inductors, often used in analog integrated circuits for wireless applications, have very small dimensions, thus even a low power dissipation can give rise to elevated temperatures in circuits containing these elements. The thermal analysis is divided into two parts. First, the inductors thermal behavior is investigated using infrared thermography. Next, a theoretical model is developed and compared with the experimental measurements and numerical simulations.

► A theoretical heat transfer model of integrated spiral inductors is developed.
► Integrated inductors thermal resistance is rather high.
► Paint layer on integrated circuits has major influence on temperature measurements.
► The electric insulating SiO2 layer is the reason for the high thermal resistance.