Directed self-assembly of mesoscopic electronic components into sparse arrays with controlled orientation using diamagnetic levitation

• Self-assembly of semiconductor dies into arrays using diamagnetic levitation.
• Control over the die orientation in vertical and lateral dimensions.
• Simulation shows good scalability of assembly time with the number of dies.
• Suitable for assembly of LED panels, displays and microcell photovoltaics.

This paper presents a directed self-assembly (DSA) approach for assembling small electronic components, such as semiconductor dies, into sparse 2D arrays using diamagnetic levitation. The dies attached to a diamagnetic layer can be levitated at a room temperature over a stage made of magnets arranged in a checkerboard pattern. By selecting a proper die design, levitation height, and vibration pattern of the magnetic stage we assemble the dies into a regular 2D array with a specific lateral and vertical orientation of the dies. The assembled dies are transferred to a receiving substrate using capillary force.