Investigation on Recrystallization of Cu-Nb Micro-composites by the Method of Resistance

In this paper, high strength and high conductivity Cu-18%vol.Nb micro-composites were fabricated by the bundling and drawing process. The materials experienced severe plastic deformation during the repeating bundling process, which accumulated plenty of dislocations and vacancies among Cu/Nb interface, Cu matrix and Nb filaments. The morphology of Cu matrix recrystallization has been observed. And it exhibits great difference between Cu at the edge area and that adjoining Nb filaments. Resistance measurements are introduced to realize the recrystallization behaviour of this kind of materials. The introduction of Nb elements to Cu shown great influence on the form of dislocations and deformation twins, and resistivity of Cu matrix varies significantly with the addition of filaments connecting with changes of defect density.