Investigation of Cooling Effect of Hot-stamping Dies by Numerical Simulation

As the development of hot-stamping technology, the designing of hot-stamping dies has more and more request. The cooling effect of hot-stamping dies can affect the mechanical properties of hot-stamping parts and the production efficiency of hot-stamping process directly, so it is an important index to evaluate the performance of dies. The cooling effect of hot-stamping dies was simulated by CFX software, and the define method of contact thermo resistance was presented in the process of simulation. Besides, the effect of processing parameters, such as pressure–holding time and cooling water velocity, on the cooling effect of hot-stamping dies was investigated and verified by experiments. Comparisons show that numerical simulation results have a good agreement with experimental results, so the FE model is effective in simulation of hot-stamping process.