Micro structuring of transparent materials with NIR ns-laser pulses

A current challenge in laser processing is high precision micromachining of transparent materials, e.g. to manufacture microoptical elements. This can be achieved amongst others by using laser induced backside wet etching. Research has been done by several groups in the last years. Most of the published results were obtained by using UV excimer lasers. Our approach deals with the implementation of the technique for NIR laser sources. We investigated the effects of different pulse widths and repetition rates on laser induced back side wet etching for 1064 nm wavelength and for different absorbers.