کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
288330 | 509617 | 2013 | 15 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A model for computing vibration induced stresses of electronic components in a general flexible mounting
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی عمران و سازه
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: A model for computing vibration induced stresses of electronic components in a general flexible mounting A model for computing vibration induced stresses of electronic components in a general flexible mounting](/preview/png/288330.png)
چکیده انگلیسی
This paper develops a novel full analytic model for vibration analysis of solid-state electronic components. The model is just as accurate as finite element models and numerically light enough to permit for quick design trade-offs and statistical analysis. The paper shows the development of the model, comparison to finite elements and an application to a common engineering problem. A gull-wing flat pack component was selected as the benchmark test case, although the presented methodology is applicable to a wide range of component packages. Results showed very good agreement between the presented method and finite elements and demonstrated the usefulness of the method in how to use standard test data for a general application.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Sound and Vibration - Volume 332, Issue 20, 30 September 2013, Pages 5192–5206
Journal: Journal of Sound and Vibration - Volume 332, Issue 20, 30 September 2013, Pages 5192–5206
نویسندگان
Gustavo H.C. Silva, Paulo J. Paupitz Gonçalves,