Statistical analysis on the effect of calendering process parameters on the geometry and conductivity of printed patterns

The quality of printed electronics products depends largely on geometrical and morphological characteristics of printed pattern, such as pattern thickness and surface roughness. In this study, we employ the calendering process in order to control the pattern thickness, surface roughness, and conductivity of printed pattern. Both pressure and heat are used to change micro structure as well as morphology of printed layer during the calendering process. The effect of process parameters including temperature, pressure, and speed are investigated by using statistical techniques. Individual effects and interaction effects of the parameters are analyzed with Analysis of Variance (ANOVA) method. The results show that the pattern thickness, surface roughness, and resistivity of printed pattern decrease with increase of temperature and pressure. We also report that temperature is the most influential factor among the parameters. This study demonstrates that the calendering process can be used to enhance the quality of printed electronics products by controlling the surface quality of printed layer.

► This paper presents calendering process as a viable solution for improving the pattern thickness, surface roughness, and conductivity of printed patterns.
► Experiments have been conducted using a large-scale roll-to-roll printing machine and a calendering machine.
► Influential parameters of calendering process are identified by statistical analysis.